At Gelest, we partner with innovators to push the boundaries of what’s possible. Our ExSil™ engineered silicone systems are developed through application-driven formulation to protect performance in demanding environments—delivering thermal stability, electrical insulation, mechanical protection, and long-term reliability across electronics, aerospace, and advanced manufacturing.
Start the conversationGelest’s engineered silicone systems protect critical electronic assemblies in aerospace, space, and power electronics environments where thermal cycling, vibration, voltage stress, and environmental exposure challenge long-term reliability. Our patented self-bonding technology enables adhesion at low curing temperatures, while tailored potting and encapsulation systems provide electrical insulation, environmental sealing, and mechanical protection for consistent performance in demanding applications.
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ExSil™ silicone gels and potting compounds are engineered to protect power electronics operating under sustained thermal stress. These low-modulus systems provide electrical insulation, mechanical stress relief, and stable performance across thermal cycling and elevated temperatures.
Flowable, heat-curable formulations offer excellent dielectric properties and can be tailored with flame-resistant chemistries to meet demanding safety and reliability requirements—delivering durable encapsulation for high-power, high-temperature applications.
As power density and system complexity increase, materials must perform reliably under demanding thermal and environmental conditions. Effective solutions must balance heat dissipation with electrical integrity and mechanical protection.
ExSil™ engineered silicone systems are developed for aerospace electronics, advanced automotive systems, and high-performance devices. Our portfolio includes thermally conductive materials, gels, and adhesives designed for specific substrates, geometries, and operating environments—supporting reliable performance in high-power applications.
Additive manufacturing is enabling complex, high-performance components across aerospace, defense, and advanced electronics. Silicone materials support intricate geometries and functional integration beyond traditional processing methods.
Gelest partners with equipment manufacturers to develop printable silicone formulations tailored to specific dispensing technologies and cure systems. Our materials are engineered for controlled rheology, reliable deposition, and strong interlayer adhesion—supporting print resolution, process consistency, and performance in demanding applications.
Aerospace and defense systems operate in some of the most demanding environments on earth — and beyond it. From satellites and launch vehicles to hypersonic platforms and advanced avionics, these applications demand materials that remain flexible, durable, and stable across extreme temperature cycling, vacuum exposure, radiation, and sustained mechanical stress. Silicone materials are uniquely suited to meet these challenges, offering thermal stability, elastic compliance, and resistance to degradation under the most punishing conditions. Through the ExSil™ platform, Gelest partners with aerospace innovators to develop silicone formulations tailored to next-generation mission requirements.
Medical devices increasingly incorporate miniaturized sensors, embedded electronics, and wireless components that must perform reliably within compact and mechanically dynamic environments. Materials used to protect these systems must maintain flexibility, electrical insulation, and long-term stability — all while meeting stringent device reliability requirements. ExSil™ soft silicone gels and encapsulation systems are engineered to help protect sensitive medical electronics from mechanical strain, moisture exposure, and environmental stress. Their low-modulus properties cushion delicate circuitry, sensors, and wire bonds while preserving stable dielectric performance within tightly integrated device architectures.
Advances in industrial automation, connected devices, and additive manufacturing are driving new requirements for materials that protect electronics while keeping pace with evolving production processes. Industrial systems increasingly integrate sensors, control electronics, and power components that must operate reliably within compact assemblies exposed to vibration, heat, and demanding duty cycles. Silicone materials provide a versatile foundation for these applications, offering inherent elasticity, thermal stability, and broad compatibility with complex assembly formats. The ExSil™ platform supports collaborative formulation development with technology manufacturers seeking materials aligned to their specific processing and performance needs.
As semiconductor devices evolve toward higher power densities, smaller geometries, and more complex packaging architectures, the materials used to protect and integrate sensitive components must evolve with them. Electrical insulation, thermal stability, and mechanical compliance must work together to ensure long-term reliability across temperature cycling, CTE mismatches, and increasingly integrated device structures. Silicone materials are well established in electronic assemblies for encapsulation, gap filling, thermal management, and environmental protection — and the ExSil™ platform brings a formulation-forward approach to meeting the specific demands of next-generation semiconductor applications.
An innovator in materials science and technology, Gelest manufactures and supplies specialty silanes, silicones, acrylates, and metal-organic compounds to some of the world’s most innovative companies.
From aerospace to microelectronics, Gelest serves a diverse range of markets. We specialize in custom compound development to develop the exact solution for the exact client need.
Gelest has cultivated a tightly connected network of worldwide distributors to support its clients, ensuring products get to where they need to be—on time, every time.
Gelest manufactures and supplies specialty silanes, silicones, acrylates, and metal-organic compounds to some of the world’s most innovative companies.